Specification for E lectr o-Magnetic Buzzer
(SMD Type)

Page 2?of 6

1. Technical Parameter

Measuring condition
Part shall be measured under a condition (Temperature: 5～35℃, Humidity: 45%～85%R.H., Atmospheric pressure: 860 ～1060hPa) unless the standard condition (Temperature: 25±3℃, Humidity: 60±10%R.H. Atmospheric pressure: 860 ～1060hPa) is regulated to measure.

1. Electrical And Acoustical Measuring Condition

1. Frequency Response

1. Surface mounting condition

5.1 Reflow soldering
Recommendable reflow soldering condition is as follows.

Note : (1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding
and pulling forces or shocks against the SMD sound transducers shall be kept minimum
to prevent them from electrical failures and mechanical damages of the devices.
(2)?In the reflow soldering, too high soldering temperatures and too large temperature
Gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.

1. Reliability Test

After any following tests the part?shall meet specifications?without any?degradation?in
appearance and?performance except SPL.?SPL shall not deviate more than -10 dB
from the initial value

1. Ordinary Temperature Life Test

The part shall be subjected to 96 hours at 25±10℃. Input rated voltage
Resonant frequency, 1/2 duty Square wave.
6.2 High Temperature Test
The part shall be capable of?with standing a storage temperature?of +80℃?for 96?hours.
6.3 L ow T emperature T est
The part shall be capable of?with standing a storage temperature?of -30℃?for 96?hours.

1. H umidity T est

Temperature:+40℃±3℃ ??Relative Humidity:90%～95% Duration: 48 hours
and expose to room temperature?for 6 hours

1. Temperature Shock Test

Temperature:60℃ /1hour→ 25℃/3hours→-20℃/1hour→ 25℃/3hours (1cycle)
Total cycle: 10 cycles

1. D rop T est

Standard Packaging From 75cm(Drop on hard wood or board of?5cm thick,
three sides, six plain.)

1. Vibration Test

Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axes

1. Reflow Test

Use recommendable reflow soldering condition?(as shown in 5.1)
(1) No abnormality?should be found?after reflow
(2) Good soldering?to meet soldering?requirements

Note:
As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas)?do not enter this product in your production processes. The functional degradation?(e.g. SPL down) may occur if foreign material enter it.

1. Packing